The ADTF3175 is a complete Time-of-Flight (ToF) module for high resolution 3D depth sensing and vision systems. Based on the ADSD3100, a 1 Megapixel CMOS…
According to a market report from China “global mobile phone image sensor market is declining, and it is recommended to deploy multi-level product lines, combined…
In a paper titled “Evolution of Image Sensor Architectures With Stacked Device Technologies” in IEEE TED (June 2022) Y. Oike writes: The evolution of CMOS…
Global Mobile Market Decline by ~5% in 2022. MizuhoSecurities maintains their fundamental view that momentum will be stronger for high-end smartphones than for middle- and…
From Semiconductor Digest news: Global installed capacity for image sensors was one million 200mm-equivalent wafers per month at the end of 2021. According to the…
A team from MIT Media Lab has posted a new arXiv preprint titled “Physics vs. Learned Priors: Rethinking Camera and Algorithm Design for Task-Specific Imaging”.…
China’s smartphone sales declined for 10 consecutive weeks since the 6th week of 2022 when compared to the same period in 2021, according to Counterpoint…
In Feb 2022, Qualcomm announced its fifth-generation 5G modem design: the Snapdragon X70. Qualcomm has announced new features and milestones for the Snapdragon X70 5G modem ahead…
Entering a period of robust growth In 2022, the global semiconductor chip industry is expected to reach about US$600 billion. But while it’s still dwarfed by…
Prof. Edoardo Charbon: Photon counting has entered the realm of image sensing with the creation of deep-submicron CMOS SPAD technology. The format of SPAD image sensors…