According to Digitimes, both II-VI and Sony are eyeing business opportunities related to Apple’s vertical-cavity surface-emitting laser (VCSEL) chips for 3D sensing modules. Lumentum and its partners, including epitaxial wafer…
Hybrid Bonding Technologies Info Hybrid Bonding Example: Sony IMX990/991 (one of the first commercially available devices utilizing die to wafer hybrid bonnding), where a InGaAs…
In a recent preprint ( https://arxiv.org/pdf/2209.11772.pdf) Gyongy et al. describe a new 64×32 SPAD-based direct time-of-flight sensor with in-pixel histogramming and processing capability. 3D flash…
In a recent preprint ( https://arxiv.org/ftp/arxiv/papers/2209/2209.14242.pdf) Ponizovskaya-Devine et al. describe a new Ge-on-Si image sensor with enhanced sensitivity up to 1.7um for NIR applications. Abstract…
Declines continued for the traditional PC market as global shipments totaled 74.3M units during 3Q22 (3Q22), according to IDC. Cooling demand and uneven supply have…
For most of the last two decades strong growth in CMOS image sensors pushed this product category to the top of the optoelectronics market, in…
According to IC Insights, the automotive IC marketshare has steadily increased since 1998 growing from 4.7% of total IC sales that year to 7.4% in…
iPhone 14 vs iPhone 13: Cameras The iPhone 14 has two cameras on the back, just like the iPhone 13, but the newer model includes a…
Strategy Analytics research director Sravan Kundojjala has said that in 2Q22, the inventories of the world’s major IC design companies increased by 13% QoQ, reaching…
13 Sep 2022 Yole Intelligence says that Sony is looking to consolidate its leading position as the market begins a new growth cycle. Analysts at…