The ADTF3175 is a complete Time-of-Flight (ToF) module for high resolution 3D depth sensing and vision systems. Based on the ADSD3100, a 1 Megapixel CMOS indirect Time-of-Flight (iToF) imager, the ADTF3175 also integrates the lens and optical bandpass filter for the imager, an infrared illumination source containing optics, laser diode, laser diode driver and photodetector, a flash memory, and power regulators to generate local supply voltages. The module is fully calibrated at multiple range and resolution modes. To complete the depth sensing system, the raw image data from the ADTF3175 is processed externally by the host system processor or depth ISP.
The ADTF3175 image data output interfaces electrically to the host system over a 4-lane mobile industry processor interface (MIPI), Camera Serial Interface 2 (CSI-2) Tx interface. The module programming and operation are controlled through 4-wire SPI and I2C serial interfaces.
The ADTF3175 has module dimensions of 42mm × 31mm × 15.1mm, and is specified over an operating temperature range of -20°C to 65°C.
Augmented reality (AR) systems
$197 in 1,000 Unit Quantities
The ADSD3030 is a CMOS 3D Time of Flight (ToF)-based 3D depth and 2D visual light imager that is available for integration into 3D sensor systems. The functional blocks required for read out, which include analog-to-digital converters (ADCs), amplifiers, pixel biasing circuitry, and sensor control logic, are built into the chip to enable a cost-effective and simple implementation into systems.
The ADSD3030 interfaces electrically to a host system over a mobile industry processor interface (MIPI), Camera Serial Interface 2 (CSI-2) interface. A lens plus optical band-pass filter for the imager and an infrared light source plus an associated driver are required to complete the working subsystem.
Augmented reality (AR) and virtual reality (VR)
Machine vision systems (logistics and inventory)
Robotics (consumer and industrial)
Originally published at http://image-sensors-world.blogspot.com.